loader

  • Intel® 8th/9th Generation Core™ LGA1151 Socket Processor
  • DDR4 SODIMM x 2, Up to 32GB
  • Two Independent Display: DP, HDMI, eDP, LVDS
  • M.2 Slot (M-key, 2242) x 1, M.2 Slot (E-key) x 1
  • PCIe [x4] x 1
  • USB 3.2 Gen 1 x 4, USB 2.0 x 5
  • 12V DC
  • Low Profile

Specification

Processor

8th Gen. Intel® Core™ LGA 1151 socket Processor
(formerly Coffee Lake-S), Max. 65W TDPs

Form Factor

Mini-ITX: 6.7” x 6.7” (170mm x 170mm)

System Memory

DDR4 2666 MHz SODIMM x 2, Up to 32GB, Non-ECC, Unbuffered
Memory, Dual channel memory architecture

Chipset

Intel® H310 Express Chipset

H/W Status Monitoring

Temperature Monitor on CPU/System, Voltage Monitor on
Vcore/5V/12V,Fan Monitor on CPU/Chassis

Expansion Slots

PCIe3.0 [x4] x 1 M.2 E-key(22 x 30 mm) x 1 for Wireless-wifi
module (PCIe+USB)

Operating System

Windows® 10 64-bit, ,Linux Ubuntu 18.04 LTS

BIOS

128Mbit Flash ROM, AMI BIOS

Wake on LAN

Yes (WOL / PXE)

Watchdog Timer

1~255 step by software program

TPM

NPCT650ABBYX TPM2.0 onboard (default: No)

Power State

S3, S4, S5

USB

USB 3.2 Gen 2 Gen.1 (5 Gbps) x 4

Ethernet

Realtek ® PCIe Gb LAN RTL8111H

Storage

SATA3.0 (6.0Gb/s) x 2
M.2 M-key (SATA) (22 x 42mm) x 1

Audio

Realtek® ALC887 with AMP

Display Chipset

Intel® UHD Graphics

Multi Display

HDMI1+HDMI2, HDMI1+DP2, DP1+HDMI2, HDMI1+LVDS,
HDMI2+LVDS,HDMI1+eDP, HDMI2+eDP, DP1+DP2,
DP1+LVDS, DP2+LVDS, DP1+eDP,DP2+eDP

LVDS

Up to 1920 x 1200 @ 60 Hz, dual-channel 18/24 bit (via CH
7511)

DIO

Digital I/O box header x 1

Fan

4-pin CPU Fan connector x 1, 4-pin Chassis Fan
connector x 1

Battery

Lithium battery

Power Requirement

12V DC

Operating Humidity

0% ~ 90% RH, non-condensing

Operating Temperature

32°F ~140°F (0°C ~ 60°C)

Storage Temperature

-40 °F ~ 185 °F (-40 °C ~ 85 °C)

Gross weight

1.1 lb (0.5 kg)

Dimensions(L x W)

6.7" x 6.7"(170mm x 170mm)

MTBF (Hours)

246,210